CAS No.:
14808-60-7
Nano-silica polishing powder has uniform particles, good dispersibility and good mirror effect. It is widely used for nano-level planarization polishing of various materials.
polishing characteristics: It has wide application fields, high polishing efficiency, high polishing brightness, fine luster, and solves the problems of material surface roughness, waviness and surface defects.
Polishing range: polishing processing of silicon wafer, germanium wafer, compound semiconductor materials gallium arsenide, indium phosphide, optical devices, metal mirror polishing, sapphire wafer, etc.
Packing: 10kg/bag.
Storage: Closed storage at room temperature.
